E-Facts


Clearly structured, and each number provides a strong argument: The most important facts and figures on the E by DEK.

If you would like to receive additional information, simply contact the E-Team.

 E by DEK

 Machine Performance

Specification

Alignment

> 2.0 Cmk @ ± 12.5 μm (± 6 sigma)

System alignment capability

> 2.0 Cmk @ ± 25 μm (± 6 sigma)

Opyimum core cycle time

8 seconds

Substrate size

50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y)

Operating System

Windows 7 Embedded

Squeegee pressure mechanism

Software-controlled, motorized with closed loop feedback

Stencil positioning

Semi-auto stencil load with drip tray

 Understencil cleaning

Interchangeable understencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe

Adjustable-width stencil mount (AWSM)

Frame variants - fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm

Substrate thickness

0.2 mm to 6 mm

Substrate weight (maximum)

6 kg

Substrate warpage

Up to 7 mm including substrate thickness

Substrate fixture

Over the top clamps
Edge clamps
Foil-less clamps
Vacuum

Temperature & humidity sensor

Monitoring of the process environment

* Alignment qualifications include board loading/unloading, board clamping, camera/table movement. Capability value is calculated with 3rd-party QC-Calc software.

# Machine capability comprises board loading/unloading, board clamping, camera/rising table movement and print process. The capability value is calculated with 3rd-party QC-Calc software.

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